Morphology Control of Electroless Copper Plating Deposit
نویسندگان
چکیده
منابع مشابه
Bath and Deposit Monitoring System for Electroless Nickel Plating Process
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54 ELECTROLESS PLATING OF NICKELONTO 4,059,710 1 1/1977 Nishiyama .......................... 427/438 SURFACES SUCH AS COPPER OR FUSED 4,136,216 1/1979 Feldstein ....... ... 427/306 TUNGSTON 4,167,416 9/1979 Zola ......... ... 427/438 4,220,678 9/1980 Feldstein ... ... 427/305 75) Inventor: Jon E. Bengston, Newington, Conn. 4,239,813 12/1980 Murakami. ... 427A306 s 4,276,323 6/1981 Oka ............
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 2005
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.8.508